Contents 1 Copper Microstructure Impact on Evolution of Electromigration Induced
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The Effect of Microstructure on Electromigration-Induced Failure Development
The effect of the microstructure on the electromigration failure development is analyzed. We investigate the influence of the statistical distribution of copper grain sizes on the electromigration time to failure distribution. Also, the effect of the microstructure on the formation and development of an electromigration-induced void is studied by simulation and the results are compared with exp...
متن کاملP 17 Microstructure and Stress Aspects of Electromigration Modeling
The electromigration behaviour of copper interconnects realized in damascene architecture indicates macroscopic and microscopic electromigration divergence sites. Macroscopic divergence sites exist at the cathode end of via bottoms where the barrier layer can be a blocking boundary for the electromigration flux. As microscopic divergence can be considered triple point sites of the grain boundar...
متن کاملElectromigration Modeling for Interconnect Structures in Microelectronics
Electromigration is one of the most important reliability issues in semiconductor technology. Its complex character demands comprehensive physical modeling as basis for analysis. Simulation of electromigration induced interconnect failure focuses on the life-cycle of intrinsic voids, which consists of two distinct phases: void nucleation and void evolution. We present models for both phases as ...
متن کاملModeling the copper microstructure and elastic anisotropy and studying its impact on reliability in nanoscale interconnects
Background: Copper is the primary metal used in integrated circuit manufacturing of today. Even though copper is face centered cubic it has significant mechanical anisotropy depending on the crystallographic orientations. Copper metal lines in integrated circuits are polycrystalline and typically have lognormal grain size distribution. The polycrystalline microstructure is known to impact the r...
متن کاملMicrostructure Evolution in Damascene Interconnects
We have developed a 3-dimensional computer simulation tool to study the characteristics of microstructure evolution in damascene interconnects. This tool is based on the Monte Carlo method, and the characteristics of the microstructure evolution have a significant impact on the interconnect reliability. Our simulation results show that it may not be possible to obtain a bamboo microstructure th...
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تاریخ انتشار 2009